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ASUS H61M-E
Intel Socket 1155, Intel h61(B3), 2 x DIMM, Max. 16GB, D-Sub, PCIe3.0/2.0, 4 x SATA, Gigabit LAN, USB 2.0, uATX Form Factor







 SKU:   1024482331
 Manufacturer:   
 Mfg. Part number:   H61M-E
 Retail Price:   $55.00
 Our Price:    $47.69
 


  






Processor family
Intel

Compatible processor series
Celeron, Core i3, Core i5, Core i7, Pentium

Processor socket
Socket H2 (LGA 1155)

Supported memory types
DDR3-SDRAM

Memory slots type
DIMM

Internal memory
16 GB

Memory channels
Dual

Non-ECC
Yes

Supported memory clock speeds
1066, 1333, 1600, 1866, 2000, 2133, 2200 MHz

Memory slots
2

Width
22.6 cm

Depth
17.5 cm

Ethernet LAN connection
Yes

LAN controller
Realtek RTL8111F

USB 2.0 connectors
3

Supported hard disk drive interfaces
SATA

Number of SATA connectors
4

CPU fan connector
Yes

Number of EATX power connectors
1

Number of chassis fan connectors
1

Peripheral (Molex) power connectors (4-pin)
1

USB 2.0 ports quantity
4

Ethernet LAN (RJ-45) ports quantity
1

PS/2 ports quantity
2

Headphone outputs
1

Microphone in
Yes

VGA (D-Sub) ports quantity
1

DVI-D ports quantity
1

Cables included
SATA

Quick installation guide
Yes

PCI Express x1 slots
2

PCI Express x16 slots
1

BIOS type
UEFI

BIOS memory size
64 MB

ACPI version
2.0a

Maximum graphics adapter memory
1024 MB

Parallel processing technology support
No

Maximum resolution
2048 x 1536 pixels

Component for
PC

Motherboard chipset family
Intel

Chipset
Intel H61

Motherboard form factor
Micro ATX

Audio output channels
7.1

Audio system
Realtek® ALC887
Intuitive UEFI BIOS and easy network controls on H61 platform

- UEFI BIOS - Flexible & Easy BIOS Interface
- Network iControl - Regulate Network Bandwidth Real-time
- Anti-Surge - Full-time Power Guardian-Make System Free From Risk
- ESD Protection - Protect Your Computer with ESD Guards
- AI Suite II - One-stop Access to Innovative ASUS Features

LGA1155 socket for Intel® 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium® / Celeron® Processors

This motherboard supports the Intel® 3rd/2nd generation Core™ i7/i5/i3/Pentium®/Celeron® processors in the LGA1155 package, with iGPU, memory, and PCI Express controllers integrated to support onboard graphics out with dedicated chipsets, 2-channel (2 DIMMs) DDR3 memory, and 16 PCI Express 3.0/2.0 lanes. This provides great graphics performance. Intel® 3rd/2nd generation Core™ i7/i5/i3/Pentium®/Celeron® processors are among the most powerful and energy efficient CPUs in the world.

Intel® H61 Express Chipset

The Intel® H61 Express Chipset is a single-chipset design to support the new 1155 socket Intel® 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium® / Celeron® processors. It provides improved performance by utilizing serial point-to-point links, which allows increased bandwidth and stability.

PCIe 3.0 Ready

The latest PCI Express bus standard delivers improved encoding for twice the performance of current PCIe 2.0. Total bandwidth for a x16 link reaches a maximum of 32GB/s, double the 16GB/s of PCIe 2.0 (in x16 mode). PCIe 3.0 provides users unprecedented data speeds, combined with the convenience and seamless transition offered by complete backward compatibility with PCIe 1.0 and PCIe 2.0 devices. It’s a must-have feature for PC users aiming to improve and optimize graphics performance, as well as have the latest, most future-proof technology.

Dual-Channel DDR3 2200(O.C )/2133(O.C )/2000(O.C ) /1866(O.C )/1600/1333/1066 support

The motherboard supports DDR3 memory that features data transfer rates of 2200(O.C )/2133(O.C )/2000(O.C )/1866(O.C )/1600/1333/1066 suppor MHz to meet the higher bandwidth requirements of the latest 3D graphics, multimedia, and Internet applications. The dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost system performance

GreenASUS and ErP Ready

The motherboard is European Union´s Energy-related Products (ErP) ready, and ErP requires products to meet certain energy efficiency requirements in regards to energy consumptions. This is in line with ASUS vision of creating environment-friendly and energy-efficient products through product design and innovation to reduce carbon footprint of the product and thus mitigate environmental impacts.
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